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TVT, 2019, Volume 57, Issue 2, Pages 203–206 (Mi tvt11100)  

Thermophysical Properties of Materials

Thermal expansion and electrical resistivity of the intermetallic compound $ Ti_{67}\rm Al_{33}$

Zh. Kh. Murlievaab, D. K. Palchaeva, M. E. Iskhakova, M. Kh. Rabadanova, U. U. Bagomedovaa

a Daghestan State University, Makhachkala
b Daghestan State Institute of National Economy

Abstract: The thermal expansion coefficient and electrical resistivity are measured simultaneously on the same polycrystalline sample of $ Ti_{67}\rm Al_{33}$ in the temperature range of $300$$1000$ K. The two measured parameters exhibit a qualitative correlation for both the stable and metastable states of the sample. The temperature dependence of the electrical resistivity is shaped by the competition between the semiconductor and metal conductivity mechanisms.

Funding Agency Grant Number
Ministry of Education and Science of the Russian Federation 3.5982.2017/8.9
The work was supported within a state assignment no. 3.5982.2017/8.9.

Author to whom correspondence should be addressed

DOI: https://doi.org/10.1134/S0040364419020133

Full text: PDF file (364 kB)
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English version:
High Temperature, 2019, 57:2, 182–185

Bibliographic databases:

UDC: 537.311.3
Received: 04.08.2018
Accepted:25.12.2018

Citation: Zh. Kh. Murlieva, D. K. Palchaev, M. E. Iskhakov, M. Kh. Rabadanov, U. U. Bagomedova, “Thermal expansion and electrical resistivity of the intermetallic compound $ Ti_{67}\rm Al_{33}$”, TVT, 57:2 (2019), 203–206; High Temperature, 57:2 (2019), 182–185

Citation in format AMSBIB
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