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TVT, 1995, Volume 33, Issue 2, Pages 325–327 (Mi tvt2918)  

Short Communications

Investigation of the melting temperature of lead and POS-1 solder in porous copper- and nickel-based compounds

V. A. Sozaev, Kh. B. Khokonov, Kh. T. Shidov

Kabardino-Balkar State University, Nal'chik

Full text: PDF file (1010 kB)

English version:
High Temperature, 1995, 33:2, 323–325

Bibliographic databases:
UDC: 536.421.1+541.182.3:546.68
Received: 11.05.1994

Citation: V. A. Sozaev, Kh. B. Khokonov, Kh. T. Shidov, “Investigation of the melting temperature of lead and POS-1 solder in porous copper- and nickel-based compounds”, TVT, 33:2 (1995), 325–327; High Temperature, 33:2 (1995), 323–325

Citation in format AMSBIB
\Bibitem{SozKhoShi95}
\by V.~A.~Sozaev, Kh.~B.~Khokonov, Kh.~T.~Shidov
\paper Investigation of the melting temperature of lead and POS-1 solder in porous copper- and nickel-based compounds
\jour TVT
\yr 1995
\vol 33
\issue 2
\pages 325--327
\mathnet{http://mi.mathnet.ru/tvt2918}
\transl
\jour High Temperature
\yr 1995
\vol 33
\issue 2
\pages 323--325
\isi{http://gateway.isiknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&DestLinkType=FullRecord&DestApp=ALL_WOS&KeyUT=A1995QZ22700020}


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