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Mendeleev Communications, 2022, Volume 32, Issue 2, Pages 231–233
DOI: https://doi.org/10.1016/j.mencom.2022.03.026
(Mi mendc623)
 

This article is cited in 13 scientific papers (total in 13 papers)

Communications

Photosensitive thiol–ene composition for DLP 3D printing of thermally stable polymer materials

O. S. Korkunova, B. Ch. Kholkhoev, V. F. Burdukovskii

Baikal Institute of Nature Management, Siberian Branch of the Russian Academy of Sciences, Ulan-Ude, Russian Federation
Abstract: N-allylated derivatives with a modification degree of 80% were obtained by reacting poly[N,N′-(1,3-phenylene)isophthalamide] with allyl bromide in the presence of a strong base. Using the obtained functionalized polyamide and pentaerythritol tetrakis(3-mercaptopropionate), we formulated new photo- sensitive compositions capable of forming crosslinked structures due to UV-initiated thiol–ene polymerization. High-resolution 3D objects that are heat resistant up to 380 °C were formed using digital light processing (DLP) 3D printing
Keywords: aromatic polyamides, thiol–ene polymerization, DLP, 3D printing, photosensitive compositions, photopolymerization.
Bibliographic databases:
Document Type: Article
Language: English
Supplementary materials:
Supplementary_data_1.pdf (504.3 Kb)


Citation: O. S. Korkunova, B. Ch. Kholkhoev, V. F. Burdukovskii, “Photosensitive thiol–ene composition for DLP 3D printing of thermally stable polymer materials”, Mendeleev Commun., 32:2 (2022), 231–233
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  • This publication is cited in the following 13 articles:
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