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Mendeleev Communications, 2022, Volume 32, Issue 6, Pages 813–815
DOI: https://doi.org/10.1016/j.mencom.2022.11.035
(Mi mendc808)
 

This article is cited in 6 scientific papers (total in 6 papers)

Communications

Polybenzimidazole-based thiol-ene photosensitive composition for DLP 3D printing

B. Ch. Kholkhoeva, Z. A. Matveeva, A. N. Nikishinab, V. F. Burdukovskiia

a Baikal Institute of Nature Management, Siberian Branch of the Russian Academy of Sciences, Ulan-Ude, Russian Federation
b D. Banzarov Buryat State University, Ulan-Ude, Russian Federation
Abstract: Aphotosensitive composition based on N-allylated poly[2,2'-(p-oxydiphenylene)-5,5'-dibenzimidazole] and pentaerythritol tetrakis(3-mercaptopropionate) has been developed. This photosensitive composition is capable of forming cross-linked 3D-structures due to UV-initiated thiol-ene polymerization. Using digital light processing 3D printing, 3D-objects with high resolution, mechanical strength and thermal resistance up to 397 °C are formed.
Keywords: polybenzimidazoles, thiol-ene polymerization, digital light processing, 3D printing, photopolymerization.
Bibliographic databases:
Document Type: Article
Language: English
Supplementary materials:
Supplementary_data_1.pdf (383.2 Kb)


Citation: B. Ch. Kholkhoev, Z. A. Matveev, A. N. Nikishina, V. F. Burdukovskii, “Polybenzimidazole-based thiol-ene photosensitive composition for DLP 3D printing”, Mendeleev Commun., 32:6 (2022), 813–815
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  • https://www.mathnet.ru/eng/mendc/v32/i6/p813
  • This publication is cited in the following 6 articles:
    Citing articles in Google Scholar: Russian citations, English citations
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