Thermal expansion coefficient for copper nanoclusters by molecular-dynamic method

In the work it is carried out the molecular-dynamic research of thermal expansion linear coefficient (TLC) for copper nanoclusters of spherical and cubic shapes in the wide range of size. To this purposes the heating of nanocluster was carried out by stochastic forces method. In the work it is carried out the molecular-dynamic research of thermal expansion linear coefficient (TLC) for copper nanoclusters of spherical and cubic shapes in the wide range of size. To this purposes the heating of nanocluster was carried out by stochastic forces method.