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Fizika i Tekhnika Poluprovodnikov, 2016, Volume 50, Issue 4, Pages 549–552
(Mi phts6499)
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This article is cited in 4 scientific papers (total in 4 papers)
Manufacturing, processing, testing of materials and structures
On a reduction in cracking upon the growth of AlN on Si substrates by hydride vapor-phase epitaxy
Sh. Sh. Sharofidinovab, V. I. Nikolaevabc, A. N. Smirnovb, A. V. Chikiryakab, I. P. Nikitinab, M. A. Odnoblyudovd, V. E. Bugrova, A. E. Romanovab a St. Petersburg National Research University of Information Technologies, Mechanics and Optics
b Ioffe Institute, St. Petersburg
c OOO Perfect Crystals, St. Petersburg, Russia
d St. Petersburg Polytechnic University
Abstract:
The main problem of the epitaxial growth of thick AlN layers on a Si substrate consists in the formation of cracks, which complicates the application of structures of this kind in the fabrication of semiconductor devices. The possibility of obtaining crack-free AlN layers with a thickness exceeding 1 $\mu$m and a mirror- smooth surface by hydride vapor-phase epitaxy is demonstrated. The properties of the layers are studied by X-diffraction analysis, optical and scanning electron microscopy, and Raman spectroscopy.
Keywords:
Aluminum Nitride, Epitaxial Lateral Overgrowth, Phonon Line, Heteroepitaxial Growth, Tensile Elastic Stress.
Received: 07.07.2015 Accepted: 17.07.2015
Citation:
Sh. Sh. Sharofidinov, V. I. Nikolaev, A. N. Smirnov, A. V. Chikiryaka, I. P. Nikitina, M. A. Odnoblyudov, V. E. Bugrov, A. E. Romanov, “On a reduction in cracking upon the growth of AlN on Si substrates by hydride vapor-phase epitaxy”, Fizika i Tekhnika Poluprovodnikov, 50:4 (2016), 549–552; Semiconductors, 50:4 (2016), 541–544
Linking options:
https://www.mathnet.ru/eng/phts6499 https://www.mathnet.ru/eng/phts/v50/i4/p549
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