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Pisma v Zhurnal Tekhnicheskoi Fiziki, 2014, Volume 40, Issue 1, Pages 71–79
(Mi pjtf8046)
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This article is cited in 8 scientific papers (total in 8 papers)
Epitaxial silicon carbide on a 6" silicon wafer
S. A. Kukushkinab, A. V. Lukyanovab, A. V. Osipovab, N. A. Feoktistovab a Institute of Problems of Mechanical Engineering, Russian Academy of Sciences, St. Petersburg
b Ioffe Institute, St. Petersburg
Abstract:
The results of the growth of silicon-carbide films on silicon wafers with a large diameter of 150 mm (6") by using a new method of solid-phase epitaxy are presented. A SiC film growing on Si wafers was studied by means of spectral ellipsometry, SEM, X-ray diffraction, and Raman scattering. As follows from the studies, SiC layers are epitaxial over the entire surface of a 150-mm wafer. The wafers have no mechanical stresses, are smooth, and do not have bends. The half-width of the X-ray rocking curve (FWHM$_{\omega-\theta}$) of the wafers varies in the range from 0.7$^\circ$ to 0.8$^\circ$ across the thickness layer of 80–100 nm. The wafers are suitable as templates for the growth of SiC, AlN, GaN, ZnO, and other wide-gap semiconductors on its surface using standard CVD, HVPE, and MBE methods.
Received: 19.08.2013
Citation:
S. A. Kukushkin, A. V. Lukyanov, A. V. Osipov, N. A. Feoktistov, “Epitaxial silicon carbide on a 6" silicon wafer”, Pisma v Zhurnal Tekhnicheskoi Fiziki, 40:1 (2014), 71–79; Tech. Phys. Lett., 40:1 (2014), 36–39
Linking options:
https://www.mathnet.ru/eng/pjtf8046 https://www.mathnet.ru/eng/pjtf/v40/i1/p71
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