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Micro- and nanocrystalline, porous, composite semiconductors
Current transfer in a semiconductor structure with a porous silicon film formed by metal-stimulated etching
N. N. Mel'nika, V. V. Tregulovb, V. G. Litvinovc, A. V. Ermachikhinc, E. P. Trusovc, G. N. Skoptsovab, A. I. Ivanovb a P. N. Lebedev Physical Institute, Russian Academy of Sciences, 119991 Moscow, Russia
b Ryazan State University S. A. Esenin, 390000 Ryazan, Russia
c Ryazan State Radio Engineering University, 390005 Ryazan, Russia
Abstract:
It is shown that during a porous Si film formation by metal-stimulated etching a barrier layer is formed on a monocrystal $p$-Si substrate. The rectifying properties of the semiconductor structure can be explained by the fixation of the Fermi level in the near-surface layer of porous Si due to a high concentration of electrically active defects (deep centers or traps). It causes to energy bands bending and the appearance of a potential barrier. The study of Raman scattering showed the absence of size effects and a change in the band gap in the porous Si film. Activation energies of deep centers by the temperature dependence of the current-voltage characteristics and deep level transient spectroscopy study were determined.
Keywords:
porous silicon, deep level, Raman scattering, current-voltage characteristics, deep level transient spectroscopy.
Citation:
N. N. Mel'nik, V. V. Tregulov, V. G. Litvinov, A. V. Ermachikhin, E. P. Trusov, G. N. Skoptsova, A. I. Ivanov, “Current transfer in a semiconductor structure with a porous silicon film formed by metal-stimulated etching”, Fizika i Tekhnika Poluprovodnikov, 56:4 (2022), 420–425
Linking options:
https://www.mathnet.ru/eng/phts7032 https://www.mathnet.ru/eng/phts/v56/i4/p420
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